個人信息：

姓名：侯宏宇

專業(yè)：管理科學與工程

學號：4115008031

班級：B1541

導師：吳鋒

學位論文題目：

  考慮消費者公平關切的數(shù)字內(nèi)容產(chǎn)品定價策略研究

學位申請成果目錄：

[1] Hou, Hongyu, Feng Wu*, and Xiangyin Kong. "Optimal pricing strategy for content products under competition: Pay-as-you-want or fixed-price?." Computers & Industrial Engineering 181 (2023): 109298.（SCI，JCR分區(qū)Q1；bwin必贏唯一官網(wǎng)最具學術影響力期刊，序號：37）

[2] Hou, Hongyu, Feng Wu*, and Xin Huang. "Dynamic pricing strategy for content products considering consumer fairness concerns and strategic behavior." Industrial Management & Data Systems (2024).（SCI，JCR分區(qū)Q1；bwin必贏唯一官網(wǎng)最具學術影響力期刊，序號：101）

[3] Hou Hongyu, and Wu Feng*. "AUTOMATED DEFECT INSPECTION ALGORITHM FOR SEMICONDUCTOR-PACKAGED CHIPS." International Journal of Industrial Engineering 27.5 (2020).

[4] Huang Xin*, Hou Hongyu, and Sun Mingyao. "A novel temporal recommendation method based on user query topic evolution." Knowledge-Based Systems 241 (2022): 108239.

[5] Chang Fengjiao, Wu Feng*, Chang Fengtian, and Hou Hongyu. "Research on adaptive transmission and controls of COVID-19 on the basis of a complex network." Computers & Industrial Engineering 162 (2021): 107749.

[6] Hou Hongyu and Wu Feng*. Optimal Product Line Strategy for Content Products considering Consumers’ Fairness Concerns. The 2024 POMS International Conference in China, June 28-30, 2024, Hefei, China.

[7] Hou Hongyu and Wu Feng*. Impact of blockchain technology and fairness concern on supplier’s optimal product line design of virtual goods. The 16th International Conference on Operations and Supply Chain Management, August 17-18, 2022, Tianjin, China.

[8] Hou Hongyu and Wu Feng*. Dynamic Pricing Strategy for Content Products Considering Consumers’ Fairness Concern. The 2022 POMS International Conference in China, June 24-27, 2022, Xi’an, China.

[9] Hou Hongyu and Wu Feng*. Comparison research on X-ray image quality defects detection algorithm in semiconductor manufacturing. 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering, April 19-21, 2019, Hangzhou, China.

公示時間：2024年07月31日